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Method for Electroless Nickel Deposition onto Copper Without Activation with Palladium

Method for Electroless Nickel Deposition onto Copper Without Activation with Palladium

Patent: LT 6899 B
Authors: Aldona Jagminienė, Ina Stankevičienė, Karolis Ratautas, Eugenijus Norkus, Gediminas Račiukaitis

Description: The invention relates to selective nickel deposition on copper surfaces for electronic circuits without palladium activation, enabling formation of high-purity nickel coatings.

State Research Institute Center for
Physical Sciences and Technology
Public institution
Code 302496128
VAT code LT100005300110

Savanorių st. 231, LT-02300 Vilnius
+370 645 15550
info@ftmc.lt

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